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docs: Fix typos (#6032) 

Signed-off-by: Thijs Triemstra <info@collab.nl>
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18
docs/Bed_Mesh.md
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@ -1,8 +1,8 @@
# Bed Mesh
The Bed Mesh module may be used to compensate for bed surface irregularties to
achieve a better first layer across the entire bed. It should be noted that
software based correction will not achieve perfect results, it can only
The Bed Mesh module may be used to compensate for bed surface irregularities
to achieve a better first layer across the entire bed. It should be noted
that software based correction will not achieve perfect results, it can only
approximate the shape of the bed. Bed Mesh also cannot compensate for
mechanical and electrical issues. If an axis is skewed or a probe is not
accurate then the bed_mesh module will not receive accurate results from
@ -46,7 +46,7 @@ probe_count: 5, 3
_Required_\
The probed coordinate farthest farthest from the origin. This is not
necessarily the last point probed, as the probing process occurs in a
zig-zag fashion. As with `mesh_min`, this coordiante is relative to
zig-zag fashion. As with `mesh_min`, this coordinate is relative to
the probe's location.
- `probe_count: 5, 3`\
@ -101,7 +101,7 @@ round_probe_count: 5
that the center of the mesh is probed.
The illustration below shows how the probed points are generated. As you can see,
setting the `mesh_origin` to (-10, 0) allows us to specifiy a larger mesh radius
setting the `mesh_origin` to (-10, 0) allows us to specify a larger mesh radius
of 85.
![bedmesh_round_basic](img/bedmesh_round_basic.svg)
@ -114,7 +114,7 @@ Each of the advanced options apply to round beds in the same manner.
### Mesh Interpolation
While its possible to sample the probed matrix directly using simple bilinear
While its possible to sample the probed matrix directly using simple bi-linear
interpolation to determine the Z-Values between probed points, it is often
useful to interpolate extra points using more advanced interpolation algorithms
to increase mesh density. These algorithms add curvature to the mesh,
@ -207,7 +207,7 @@ split_delta_z: .025
Generally the default values for these options are sufficient, in fact the
default value of 5mm for the `move_check_distance` may be overkill. However an
advanced user may wish to experiment with these options in an effort to squeeze
out the optimial first layer.
out the optimal first layer.
### Mesh Fade
@ -263,9 +263,9 @@ fade_target: 0
### The Relative Reference Index
Most probes are suceptible to drift, ie: inaccuracies in probing introduced by
Most probes are susceptible to drift, ie: inaccuracies in probing introduced by
heat or interference. This can make calculating the probe's z-offset
challenging, particuarly at different bed temperatures. As such, some printers
challenging, particularly at different bed temperatures. As such, some printers
use an endstop for homing the Z axis, and a probe for calibrating the mesh.
These printers can benefit from configuring the relative reference index.

16
docs/Bootloaders.md
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@ -305,7 +305,7 @@ is a [fork with builds specific to the SKR Mini E3 1.2](
https://github.com/Arksine/STM32_HID_Bootloader/releases/latest).
For generic STM32F103 boards such as the blue pill it is possible to flash
the bootloader via 3.3v serial using stm32flash as noted in the stm32duino
the bootloader via 3.3V serial using stm32flash as noted in the stm32duino
section above, substituting the file name for the desired hid bootloader binary
(ie: hid_generic_pc13.bin for the blue pill).
@ -382,7 +382,7 @@ make flash FLASH_DEVICE=/dev/ttyACM0
It may be necessary to manually enter the bootloader, this can be done by
setting "boot 0" low and "boot 1" high. On the SKR Mini E3 "Boot 1" is
not available, so it may be done by setting pin PA2 low if you flashed
"hid_btt_skr_mini_e3.bin". This pin is labeld "TX0" on the TFT header in
"hid_btt_skr_mini_e3.bin". This pin is labeled "TX0" on the TFT header in
the SKR Mini E3's "PIN" document. There is a ground pin next to PA2
which you can use to pull PA2 low.
@ -390,7 +390,7 @@ which you can use to pull PA2 low.
The [MSC bootloader](https://github.com/Telekatz/MSC-stm32f103-bootloader) is a driverless bootloader capable of flashing over USB.
It is possible to flash the bootloader via 3.3v serial using stm32flash as noted
It is possible to flash the bootloader via 3.3V serial using stm32flash as noted
in the stm32duino section above, substituting the file name for the desired
MSC bootloader binary (ie: MSCboot-Bluepill.bin for the blue pill).
@ -419,7 +419,7 @@ It is recommended to use a ST-Link Programmer to flash CanBoot, however it
should be possible to flash using `stm32flash` on STM32F103 devices, and
`dfu-util` on STM32F042/STM32F072 devices. See the previous sections in this
document for instructions on these flashing methods, substituting `canboot.bin`
for the file name where appropriate. The CanBoot repo linked above provides
for the file name where appropriate. The CanBoot repository linked above provides
instructions for building the bootloader.
The first time CanBoot has been flashed it should detect that no application
@ -448,8 +448,8 @@ When building Klipper for use with CanBoot, select the 8 KiB Bootloader option.
## STM32F4 micro-controllers (SKR Pro 1.1)
STM32F4 microcontrollers come equipped with a built-in system bootloader
capable of flashing over USB (via DFU), 3.3v Serial, and various other
STM32F4 micro-controllers come equipped with a built-in system bootloader
capable of flashing over USB (via DFU), 3.3V Serial, and various other
methods (see STM Document AN2606 for more information). Some
STM32F4 boards, such as the SKR Pro 1.1, are not able to enter the DFU
bootloader. The HID bootloader is available for STM32F405/407
@ -458,8 +458,8 @@ Note that you may need to configure and build a version specific to your
board, a [build for the SKR Pro 1.1 is available here](
https://github.com/Arksine/STM32_HID_Bootloader/releases/latest).
Unless your board is DFU capable the most accessable flashing method
is likely via 3.3v serial, which follows the same procedure as
Unless your board is DFU capable the most accessible flashing method
is likely via 3.3V serial, which follows the same procedure as
[flashing the STM32F103 using stm32flash](#stm32f103-micro-controllers-blue-pill-devices).
For example:
```

6
docs/Config_Reference.md
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@ -346,7 +346,7 @@ max_z_velocity:
#min_angle: 5
# This represents the minimum angle (in degrees) relative to horizontal
# that the deltesian arms are allowed to achieve. This parameter is
# intended to restrict the arms from becomming completely horizontal,
# intended to restrict the arms from becoming completely horizontal,
# which would risk accidental inversion of the XZ axis. The default is 5.
#print_width:
# The distance (in mm) of valid toolhead X coordinates. One may use
@ -383,7 +383,7 @@ arm_x_length:
# for stepper_right, this parameter defaults to the value specified for
# stepper_left.
# The stepper_right section is used to desribe the stepper controlling the
# The stepper_right section is used to describe the stepper controlling the
# right tower.
[stepper_right]
@ -4323,7 +4323,7 @@ serial:
#auto_load_speed: 2
# Extrude feedrate when autoloading, default is 2 (mm/s)
#auto_cancel_variation: 0.1
# Auto cancel print when ping varation is above this threshold
# Auto cancel print when ping variation is above this threshold
```
### [angle]

2
docs/Debugging.md
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@ -216,7 +216,7 @@ after the above compilation:
```
ls ./build/pysimulavr/_pysimulavr.*.so
```
This commmand should report a specific file (e.g.
This command should report a specific file (e.g.
**./build/pysimulavr/_pysimulavr.cpython-39-x86_64-linux-gnu.so**) and
not an error.

2
docs/Features.md
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@ -15,7 +15,7 @@ Klipper has several compelling features:
movement provides quieter and more stable printer operation.
* Best in class performance. Klipper is able to achieve high stepping
rates on both new and old micro-controllers. Even old 8bit
rates on both new and old micro-controllers. Even old 8-bit
micro-controllers can obtain rates over 175K steps per second. On
more recent micro-controllers, several million steps per second are
possible. Higher stepper rates enable higher print velocities. The

8
docs/Hall_Filament_Width_Sensor.md
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@ -2,7 +2,7 @@
This document describes Filament Width Sensor host module. Hardware used for
developing this host module is based on two Hall linear sensors (ss49e for
example). Sensors in the body are located opposite sides. Principle of operation:
example). Sensors in the body are located on opposite sides. Principle of operation:
two hall sensors work in differential mode, temperature drift same for sensor.
Special temperature compensation not needed.
@ -18,9 +18,9 @@ To use Hall filament width sensor, read
Sensor generates two analog output based on calculated filament width. Sum of
output voltage always equals to detected filament width. Host module monitors
voltage changes and adjusts extrusion multiplier. I use aux2 connector on
ramps-like board analog11 and analog12 pins. You can use different pins and
differenr boards.
voltage changes and adjusts extrusion multiplier. I use the aux2 connector on
a ramps-like board with the analog11 and analog12 pins. You can use different pins
and different boards.
## Template for menu variables

12
docs/Measuring_Resonances.md
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@ -19,7 +19,7 @@ that it has a voltage regulator and a level shifter.
### Wiring
An ethernet cable with shielded twisted pairs (cat5e or better) is recommended
for signal integrety over a long distance. If you still experience signal integrity
for signal integrity over a long distance. If you still experience signal integrity
issues (SPI/I2C errors), shorten the cable.
Connect ethernet cable shielding to the controller board/RPI ground.
@ -41,7 +41,7 @@ SCLK+CS
**Note: Many MCUs will work with an ADXL345 in SPI mode(eg Pi Pico), wiring and
configuration will vary according to your specific board and avaliable pins.**
configuration will vary according to your specific board and available pins.**
You need to connect ADXL345 to your Raspberry Pi via SPI. Note that the I2C
connection, which is suggested by ADXL345 documentation, has too low throughput
@ -49,7 +49,7 @@ and **will not work**. The recommended connection scheme:
| ADXL345 pin | RPi pin | RPi pin name |
|:--:|:--:|:--:|
| 3V3 (or VCC) | 01 | 3.3v DC power |
| 3V3 (or VCC) | 01 | 3.3V DC power |
| GND | 06 | Ground |
| CS | 24 | GPIO08 (SPI0_CE0_N) |
| SDO | 21 | GPIO09 (SPI0_MISO) |
@ -310,7 +310,7 @@ or you can choose some other configuration yourself based on the generated
charts: peaks in the power spectral density on the charts correspond to
the resonance frequencies of the printer.
Note that alternatively you can run the input shaper autocalibration
Note that alternatively you can run the input shaper auto-calibration
from Klipper [directly](#input-shaper-auto-calibration), which can be
convenient, for example, for the input shaper
[re-calibration](#input-shaper-re-calibration).
@ -550,9 +550,9 @@ supplying `AXIS=` parameter, like
SHAPER_CALIBRATE AXIS=X
```
**Warning!** It is not advisable to run the shaper autocalibration very
**Warning!** It is not advisable to run the shaper auto-calibration very
frequently (e.g. before every print, or every day). In order to determine
resonance frequencies, autocalibration creates intensive vibrations on each of
resonance frequencies, auto-calibration creates intensive vibrations on each of
the axes. Generally, 3D printers are not designed to withstand a prolonged
exposure to vibrations near the resonance frequencies. Doing so may increase
wear of the printer components and reduce their lifespan. There is also an

2
docs/Overview.md
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@ -54,7 +54,7 @@ communication with the Klipper developers.
perfectly square.
- [PWM tools](Using_PWM_Tools.md): Guide on how to use PWM controlled
tools such as lasers or spindles.
- [Exclude Object](Exclude_Object.md): The guide to the Exclude Objecs
- [Exclude Object](Exclude_Object.md): The guide to the Exclude Objects
implementation.
## Developer Documentation

2
docs/Packaging.md
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@ -27,4 +27,4 @@ follows: `python2 scripts/make_version.py YOURDISTRONAME > klippy/.version`.
## Sample packaging script
klipper-git is packaged for Arch Linux, and has a PKGBUILD (package build
script) available at [Arch User Repositiory](https://aur.archlinux.org/cgit/aur.git/tree/PKGBUILD?h=klipper-git).
script) available at [Arch User Repository](https://aur.archlinux.org/cgit/aur.git/tree/PKGBUILD?h=klipper-git).

6
docs/SDCard_Updates.md
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@ -127,13 +127,13 @@ BOARD_DEFS = {
```
The following fields may be specified:
- `mcu`: The mcu type. This can be retrevied after configuring the build
- `mcu`: The mcu type. This can be retrieved after configuring the build
via `make menuconfig` by running `cat .config | grep CONFIG_MCU`. This
field is required.
- `spi_bus`: The SPI bus connected to the SD Card. This should be retreived
- `spi_bus`: The SPI bus connected to the SD Card. This should be retrieved
from the board's schematic. This field is required.
- `cs_pin`: The Chip Select Pin connected to the SD Card. This should be
retreived from the board schematic. This field is required.
retrieved from the board schematic. This field is required.
- `firmware_path`: The path on the SD Card where firmware should be
transferred. The default is `firmware.bin`.
- `current_firmware_path`: The path on the SD Card where the renamed firmware